Company Profile
Forewin Flex Limited Corporation is located at 189 Jinfeng Road, Suzhou High tech Zone. It was established on September 13, 2010 and restructured into a joint-stock company on December 30, 2020, with a registered capital of 342.55 million yuan.

Forewin is a high-tech enterprise specializing in research and development, design, and production of flexible circuit boards, with internationally advanced technology. Forewin focuses on producing single, double-sided, and multi-layer flexible circuit boards, as well as multi-layer rigid flex circuit boards. The product applications cover cutting-edge and mainstream fields such as communication, camera modules, display modules, wearable devices, automotive electronics, etc. Forewin continues to focus on emerging sectors such as substrate, higher density applications, new material, and optical modules.

Forewin attaches great importance to research and development innovation, with continuous growth in research and development investment, and has established several enterprise research and development technology centers recognized at the provincial and municipal levels. Forewin have accumulated multiple independently developed technological achievements in the field of intellectual property, and have authorized invention patents both domestic and international. In 2023, the company participated in the drafting of the national standard "Specification for Flexible Multilayer Printed Boards".

In terms of upgrading intelligent manufacturing, the company actively responds to government policies such as smart transformation and digital transformation, and continues to enhance its intelligent and digital construction capabilities; From 2021 to 2023, it has successively passed the evaluation of many honorary qualifications, such as high and new technology enterprises, integrationof informationization and  industrialization  management  system (2A), star cloud (five stars), provincial Internet benchmark factory, provincial/municipal intelligent workshop, etc.
2010
Establish in
100,000
Plant area
1.4+Billion RMB
Investment Amount
Top 3
Ranking of Market Share
of Rigid-Flex in China 2
200+
Total Patent Applications
70+
Total Granted Patents
2
Provincial-Level
R&D Technology Center
2
Provincial-Level
Intelligent Workshop

Development History
Continuously improving the company's intelligent and digital construction capabilities
2024
·Initiate production at Factory 2
·Enter the phase of explosive production
2023
·Began carrier board production
·Awarded Five star cloud enterprise in Jiangsu Province
·Awarded Jiangsu Province Demonstration Intelligent Workshop
2022
·Awarded Jiangsu Internet Benchmark Factory
·Awarded Suzhou Intelligent Workshop
·Awarded Suzhou Industrial Design Center
2021
·Second phase factory construction completed
·Integrationof Informationization And Industrialization Management System Certificate
2020
·5G related overseas invention patent authorization
·Forewin has been successfully restructured and renamed as "Forewin Flex Limited Corporation"
·The 5th Excellent Enterprise in China's Electronic Circuit Industry
2018
·Entering the automotive supply chain through IATF16949 certification
·Awarded Jiangsu high precision HDI multilayer rigid flexible composite board engineering technology research center
2017
·Certified by QC080000:2012
·Certified by ISO14001:2015
·Awarded Jiangsu Province recognized enterprise technology center
2016
·Awarded private technology enterprises in Jiangsu Province
·Awarded Suzhou high precision multilayer flexible circuit board engineering technology research center
2014
·Acquisition of TTM Suzhou factory
·Awarded national high-tech enterprise
2013
·6-layer soft board mass production
·Approved supplier BYD
2010
·FOREWIN FPC (SUZHOU) CO., LTD was established
Technical History
Continuously upgrading based on RFPCB technology, gradually achieving breakthroughs in high-end product applications.
  • Advanced Phase Of Technology2020-so far

  • High End Breakthrough Phase2018-2019

  • Technological Accumulation Phase 2015-2017

  • Flex Start Up Phase2010-2014

  • Core Technology
    mSAP technology breakthrough, achieving ultra-fine lines with line width and spacing of 15-15 um
  • Core Products
    TSA optical anti shake camera module, high-end folding screen pivot screen module, high-end mobile OLED display module with Rigid-Flex and multi-layer Flex
  • Core Technology
    Advanced HDI board technology is being developed,achieved HDI anylayer technology with a line width and spacing of 40μm
  • Core Products
    High end camera, display, wearable Rigid-Flex and multi-layer Flex
  • Core Technology
    The technology of Rigid-Flex has been strengthened, and blind buried hole technology has been achieved. Circuit board layer count has exceeded 6
  • Core Products
    Rigid-Flex+HDI board
  • Core Technology
    Flex technology is starting, using the subtractive process, with line width and spacing ranging from 75-100μm
  • Core Products
    Smartphone single double multi-layer FPC
Equipment Display
Advanced equipment, swift and efficient operations, quality control, and intelligent workshops.
SMT Device
SMT Workshop
SMT Device
SMT Corridor
PCB Workshop
Substrates Workshop
Substrates Device
Column Product Application Telephone