Company Profile

Forewin Flex Limited Corporation is located at 189 Jinfeng Road, Suzhou High tech Zone. It was established on September 13, 2010 and restructured into a joint-stock company on December 30, 2020, with a registered capital of 342.55 million yuan.


Since its establishment, the company has focused on the high-end printed circuit board (PCB) field, particularly specializing in the R&D, design and production of high-end flexible printed circuits (FPC) and rigid-flex printed circuits—products with extremely high technical thresholds. It has also laid out SMT assembly business, with the overall technical level reaching international advanced standards. Its products are widely used in cutting-edge and mainstream fields such as communications, camera modules, display modules, wearable devices, automotive electronics and carrier boards. After 15 years of dedicated development, the company has successfully broken foreign monopolies in the high-end rigid-flex printed circuit field and grown into one of the leading enterprises in this sector in China.


Attaching great importance to R&D and innovation, the company has maintained continuous growth in R&D investment and established several provincial and municipal recognized enterprise R&D and technology centers. In terms of intellectual property, the company has accumulated a number of independently developed technological achievements, with a total of more than 200 patent applications and over 70 authorized patents, among which invention patents account for as high as 49%. In standard construction, the company passed the intellectual property management system certification in 2024.


In recent years, the company has also actively led the formulation of industry standards. It participated in drafting the national standard "Specifications for Flexible Multilayer Printed Boards" in 2023. This standard passed the review and was released in 2025, and will be officially implemented in 2026.


In the upgrading of intelligent manufacturing, the company has actively responded to the government's relevant policies such as intelligent transformation and digital transformation, and continuously improved its intelligent and digital construction capabilities. In recent years, it has successively won many important honors including Jiangsu Five-Star Cloud-Enabled Enterprise, Provincial Listed Cultivation Technology Enterprise, Suzhou High-tech Zone "2023 Excellent Innovative Enterprise", "Top 30 Private Enterprises" and "Contribution Award for Intelligent Transformation and Digital Transformation". In 2024, it successfully entered the chain master enterprise cultivation database and actively formed an innovation consortium to drive the upgrading of the regional industrial chain. In 2025, it was awarded the titles of Jiangsu Advanced Intelligent Factory, Suzhou Green Factory and other honorary qualifications.


2010
Establish in
100,000
Plant area
1.4+Billion RMB
Investment Amount
Top 3
Ranking of Market Share
of Rigid-Flex in China 2
200+
Total Patent Applications
70+
Total Granted Patents
2
Provincial-Level
R&D Technology Center
2
Provincial-Level
Intelligent Workshop

Development History
Continuously improving the company's intelligent and digital construction capabilities
2024
·Initiate production at Factory 2
·Enter the phase of explosive production
2023
·Began carrier board production
·Awarded Five star cloud enterprise in Jiangsu Province
·Awarded Jiangsu Province Demonstration Intelligent Workshop
2022
·Awarded Jiangsu Internet Benchmark Factory
·Awarded Suzhou Intelligent Workshop
·Awarded Suzhou Industrial Design Center
2021
·Second phase factory construction completed
·Integrationof Informationization And Industrialization Management System Certificate
2020
·5G related overseas invention patent authorization
·Forewin has been successfully restructured and renamed as "Forewin Flex Limited Corporation"
·The 5th Excellent Enterprise in China's Electronic Circuit Industry
2018
·Entering the automotive supply chain through IATF16949 certification
·Awarded Jiangsu high precision HDI multilayer rigid flexible composite board engineering technology research center
2017
·Certified by QC080000:2012
·Certified by ISO14001:2015
·Awarded Jiangsu Province recognized enterprise technology center
2016
·Awarded private technology enterprises in Jiangsu Province
·Awarded Suzhou high precision multilayer flexible circuit board engineering technology research center
2014
·Acquisition of TTM Suzhou factory
·Awarded national high-tech enterprise
2013
·6-layer soft board mass production
·Approved supplier BYD
2010
·FOREWIN FPC (SUZHOU) CO., LTD was established
Technical History
Continuously upgrading based on RFPCB technology, gradually achieving breakthroughs in high-end product applications.
  • Advanced Phase Of Technology2020-so far

  • High End Breakthrough Phase2018-2019

  • Technological Accumulation Phase 2015-2017

  • Flex Start Up Phase2010-2014

  • Core Technology
    mSAP technology breakthrough, achieving ultra-fine lines with line width and spacing of 15-15 um
  • Core Products
    TSA optical anti shake camera module, high-end folding screen pivot screen module, high-end mobile OLED display module with Rigid-Flex and multi-layer Flex
  • Core Technology
    Advanced HDI board technology is being developed,achieved HDI anylayer technology with a line width and spacing of 40μm
  • Core Products
    High end camera, display, wearable Rigid-Flex and multi-layer Flex
  • Core Technology
    The technology of Rigid-Flex has been strengthened, and blind buried hole technology has been achieved. Circuit board layer count has exceeded 6
  • Core Products
    Rigid-Flex+HDI board
  • Core Technology
    Flex technology is starting, using the subtractive process, with line width and spacing ranging from 75-100μm
  • Core Products
    Smartphone single double multi-layer FPC
Equipment Display
Advanced equipment, swift and efficient operations, quality control, and intelligent workshops.
SMT Device
SMT Workshop
SMT Device
SMT Corridor
PCB Workshop
Substrates Workshop
Substrates Device
Column Product Application Telephone