Home
About us
Company Profile
Development History
Technical History
Honor and Qualification
Equipment Display
Products
Flex
HDI Rigid-Flex
Substrates
High Frequency and High Speed
Application
Mobile Terminal
Intelligent wearables
Automotive Electronics
Network Communication
Emerging Fields
Process Capability
RF,FPC Capability
SMT Capability
Substrate Capability
News
Company news
Industry information
Information disclosure
Recruitments
Contact us
Contact Information
Message inquiry
Chinese
English
Flex
HDI Rigid-Flex
Substrates
High Frequency and High Speed
首页
>
产品中心
>
HDI Rigid-Flex
>
Camera
Camera
Display
Headset
AR
Smart Bracelet
Camera
Product mix:
1+2F+1
4L/1-stage BVH
Rigid-flex
Min Line/Space(mm):0.045/0.06
Blind Via/PAD size(mm):0.1/0.3
Surface Treatment:ENEPIG
Impedance Control:90ohm+/-10%
Process Feature:Full Cavity
Terminal Application:Camera Module
首页
关于我们
产品中心
Flex
HDI Rigid-Flex
Substrates
High Frequency and High Speed
Application
Process Capability
News
Company news
Industry information
Information disclosure
Recruitments
Contact us
Language
CN
Column
Product
Application
Telephone