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Flex
HDI Rigid-Flex
Substrates
High Frequency and High Speed
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LCM
B to B
MIC
LCM
LCM
Product mix:
3L(1+2) FPC
1-stage BVH
Min Line/Space(mm):0.05/0.05
Blind Via/PAD size(mm):0.085/0.3
Surface Treatment:ENIG
Impedance Control:90Ω±10Ω
Process Feature:
PTH+BVH Process
Post Opening Lid Process
Anti-CAF>1000H
Total picth CPK>1.33
Impedance CPK>1.33
Terminal Application:Cellphone Display Module
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HDI Rigid-Flex
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