OIS Substrates

BT Core: 30μm without copper
Technology Process: SAP Process
Copper Plating Cu-t: 25-55μm
Min Line W/S:25μm/ 15μm
Min Via: 60μm /Land: 140μm
Turns: 124T / Materials: CBF&NBF
Resistance value:±10%/±2Ω
SF: ENIG
Terminal Application:Camera anti shake motor