For storage purposes IC substrates

Materials: DS-7409-HGB(X) 0.2mm + 3μm copper
Technology Process：mSAP Process
Copper Plating: 12±3μm
Min Line W/S: 25μm/ 12μm
Min Via: 70μm
Set Size Cpk: >2.0 control
SR Thickness: top side 10μm /bottom side: 12μm
SR Type: PSR4000 AUS308
SF: OSP
Terminal Application: Storage chip