IC Chip CSP Substrates

Materials: GW1500 0.46mm(ultrasonic）
Technology Process : Tenting 4L
Cu-t:Hole copper>20μm
Surface copper>30μm
Min Line Space: 75μm/ 10μm
Total Thickness: 787±100μm
SR Thickness: 20±10μm
SR Type: PSR400 /AUS308
SF: ENIG
Terminal Application: Mobile communication chip