LCP

Product mix:4L(1+2+1)FPC ;1-stage BVH

Min Line/Space（mm）:0.08/0.1

Blind Via/PAD size（mm）:0.1/0.3

Surface Treatment:ENIG

Impedance Control:50ohm+/-10%

Terminal Application:5G

Process Feature:

1.Edge Plating

2.EMI Full package design

3.Panasonic LCP/F-705S, Dk 3.2，Df0.0016