Product mix:3L(1+2) 1-stage BVH Rigid-Flex
Min Line/Space（mm）:0.06/0.1
Blind Via/PAD size（mm）:0.1/0.3
Surface Treatment:ENIG Impedance Control:50ohm+/-10%
Terminal Application:UWB Antenna
Process Feature:
1. FPC: High Frequency MPI Materials,Dk3.22,Df0.0054，PCB：Hydrocarbon Resin Ceramic High-speed Material,Dk 6.15,Df 0.0038；
2. PCB Board Thickness 2.3mm；
3. Assembly Solution PCB+FPC: SMT Process
